Compound F2M-P

Peroxide crosslinkable non-tracking compound for heat-shrinkable moulded parts for indoor and outdoor applications up to 33 kV. The compound shows excellent weathering and non-tracking properties.

Compound properties

Compound F2M-P is a peroxide crosslinkable, heat-curable moulding compound offering excellent weathering and non-tracking properties. The carefully selected combination of polymers, fillers, additives and mould-release agents makes this compound an excellent choice for the moulding of non-tracking heat-shrinkable rain-sheds, shrouds and cable breakouts.
Products made of compound F2M-P will easily meet the requirements of ESI 09-13.

Compound characteristics

Color Red
Specific gravity ASTM D 792 1.3
MFI (160șC, 21.6kg) ASTM D 1238 10 (*)
Tracking resistance ASTM D 2303-73 No tracking, no erosion to top surface, no flame failure after:
- 1 hr. @ 2.50 kV
- 1 hr. @ 2.75 kV
- 1 hr @ 3.0 kV
- 20 min.@ 3.25 kV

Moulding

Recommended temperature profile 120șC - 135șC

Crosslinking

Recommended time min. 60 seconds (**)
Recommended mass temperature Mimimum 175șC
Hot-set elongation 60 - 100% (20 gr/mm2 and 200șC)

Packaging

The PTL compound F2M-P is packed in PE bags of 25 kg.
The compound should be stored below 30șC and protected from direct sunlight to achieve a shelf life of 6 months.

Properties of the moulded products

Heat-shrinkable moulded products made of this compound will show superior non-tracking characteristics combined with excellent erosion and UV-resistance resulting in a unexcelled field performance to meet or exceed the life of the cable itself. The low shrink temperature will result in quick and easy installation. The compound is easy processable and can be moulded on standard injection moulding and press moulding equipment.

Technical values

Property Test Method Typical value
 
Physical
Tensile strenght at break ASTM D 638 10 MPa
Elongation at break ASTM D 638 400%
 
Thermal
Continuous operating temperature   -55șC to +110șC
Low temp. flexibility (-40șC) ASTM D 2671C No cracking
Minimum shrink temperature   100șC
 
Chemical
Fungus resistance   Inert
Fluid resistance ESI 09-13 Excellent
Copper Corrosion ASTM D 2671 B Excellent
 
Electrical
Dielectric strength ASTM D 2671 10-15 kV/mm(***)
Volume resistivity ASTM D 257 10 @ 14 ohm.cm
Erosion VDE 0303 Part 1 Class KA3c

International specifications

- ESI 09-13

(*) In non-crosslinked state
(**) The crosslinking time is depending on wall-thickness.
(***) Depending on wall thickness.
 
 
 

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