Compound E3M-P
Peroxide crosslinkable compound for medium and heavy wall heat-shrinkable
moulded
parts, for aerial, underground and direct burial installation.
Compound properties
Compound E3M-P is a peroxide crosslinkable, heat curable compound offering
excellent mechanical properties and strain relief. The carefully selected
combination of polymers, processing aids and additives makes this compound
an excellent choice for the manufacturing of medium and thick wall heat-shrinkable
moulded parts for indoor and outdoor applications in the power and telecom
market.
The compound is easy processable on press-moulding and injection moulding
equipment.
Compound characteristics
| Color |
|
Black |
| Specific gravity |
ASTM D 792 |
1.10 |
| Water absorption |
ASTM D 570 |
0.15% |
| MFI (160ºC, 21.6kg) |
ASTM D 1238 |
6-8 (*) |
Moulding
Recommended temperature profile: 120ºC - 135ºC
Crosslinking
| Recommended time |
min. 60 seconds (**) |
| Recommended mass temperature |
Mimimum 175ºC |
| Hot-set elongation |
60 - 100% (20 gr/mm2 and 200ºC) |
Packaging
The peroxide crosslinkable PTL compounds are supplied in bags of 25 kg
or in octabins.
The compound should be stored below 30ºC and protected from direct sunlight to achieve
a shelf life of 6 months.
Properties of the moulded parts
Heat-shrinkable moulded products made of this compound will show a continuous
operating temperature of 110ºC. The excellent heat-ageing properties will
allow the product to withstand 250ºC for short periods. The non-corrosive
properties and its excellent resistance against ingress of chemicals,
acids and oils makes this compound an ideal choice for harsh environments.
Technical values
| Property |
Test Method |
Typical value |
| |
| Physical |
| Tensile strenght at break |
ASTM D 638 |
17 MPa |
| Elongation at break |
ASTM D 638 |
400% |
| |
| Thermal |
| Continuous operating temperature |
|
-75ºC to +110ºC |
| Minimum shrink temperature |
|
120ºC |
| Heat shock (4hrs @ 250ººC) |
ASTM D 2671 |
No cracking, dripping, flowing |
| Flowing Heat ageing (168hrs @ 150ºC) |
ASTM D 638 |
Elongation 250% |
| Low temp. flexibility (-55ºC) |
ASTM D 2671C |
No cracking |
| |
| Chemical |
| Fungus resistance |
|
Inert |
| Fluid resistance |
ESI 09-13 |
Excellent |
| Copper Corrosion |
ASTM D 2671 B |
Excellent |
| |
| Electrical |
| Dielectric strength |
ASTM D 2671 |
10-20 kV/mm |
| Volume resistivity |
ASTM D 257 |
10 @ 15 ohm.cm |
International specifications
- ESI 09-13
(*) in non-crosslinked state (**) depending on wall-thickness.
|