Compound B1-I


Radiation crosslinkable compound for flexible, halogen free
flame-retarded non-dripping and excellent printable
thin wall polyolefin heat-shrinkable tubing.

Compound properties

Compound B1-I is a radiation crosslinkable halogen free compound offering excellent mechanical and flame-retardancy properties. The carefully selected combination of polyolefin based polymers, halogen free flame-retardants, processing aids and additives makes this compound an excellent choice for the manufacturing of heat-shrinkable tubings which will easily meet the requirements of demanding and critical applications.
The compound is known for the excellent processability at high speeds with minimal melt fracture and can be extruded on standard low compression screws of 1.2 :1 pressure ratio.

Compound characteristics

Color Natural
Specific gravity ASTM D 792 1.4
Water absorption ASTM D 570 0.5%
MFI (160ºC, 21.6kg) ASTM D 1238 5
LOI ASTM D 2868 31%

Extrusion

Recommended extrusion temperature profile 125ºC - 130ºC - 140ºC - 150ºC
Recommended draw-down ratio 1.10 : 1

Crosslinking

Recommended dose 30 - 60kGy
Hot-set elongation 75 - 150 % (150ºC and 35 gr/mm2 load)

Packaging

The compound is packed in sealed PE bags of 25 kg.
We recommend to store the compound below 30ºC.

Tubing properties

Heat-shrinkable tubing made of this compound will show a continuous operating temperature of 120ºC. The excellent heat-ageing properties allows the product to withstand 250ºC for short periods. The combined flame-retardancy and printability properties of this non-blooming compound, makes the compound an excellent choice for applications were non-flame-propagating properties are required in public area's.
Tubing will be compatible with international standards and safety regulations and can be used in area's such as nuclear power plants, motorway tunnels, surface and underground transit authorities, military installations, PTT telephone exchangers, airports, public buildings etc.

Technical values

Property Test Method Typical value
 
Physical
Tensile strenght at break ASTM D 638 11 MPa
Elongation at break ASTM D 638 250%
 
Thermal
Continuous operating temperature   -55ºC to +120ºC
Minimum shrink temperature   100ºC
Heat shock (4hrs @ 250ºC) ASTM D 2671 No cracking, dripping, flowing
Heat ageing (168hrs @ 175ºC) ASTM D 638 Elongation 150%
Low temp. flexibility (-55ºC) ASTM D 2671C No cracking
 
Chemical
Fungus resistance MIL-DTL-7444 Inert
Fluid resistance MIL-DTL-23053/5 Excellent
Copper Corrosion ASTM D 2671 B Non corrosive
 
Electrical
Dielectric strength ASTM D 2671 20 kV/mm(*)
Volume resistivity ASTM D 257 10 @ 13 ohm.cm


(*) Depending on wall thickness.

 
 
 

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